Our client is a global semiconductor manufacturer specializing in embedded processing, analog, connectivity, and power solutions. They offer semiconductor products, including actuators, sensors, amplifiers, data converters, and other related components. Join them and be a part of an ever-growing team.
Job Descriptions
Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
Ramp up manufacturing volume and qualify required sources.
Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
Manage Product Lifecycle Management documents to the latest status.
Conduct change-management with suppliers to sustain / improve capacity and cost.
Job Requirements
Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
Knowledge of SPC and statistical analysis software (such as JMP).
Strong analytical, written communication and presentation skills.
Able to manage large projects effectively.