The Technical Solution Manager (TSM) for Ball Bonder (BB) and Wedge Bonder (WB) will provide customer-facing technical leadership to support business growth and customer success across Southeast Asia and India.
Job Descriptions
The primary technical contact for BB and WB customers, supporting both pre-sales and post-sales initiatives.
Offer expert consultation on ball bonding and wedge bonding processes, bonder configuration, application solutions.
Support customer evaluations, qualifications, and benchmarking for BB and WB platforms.
Work in partnership with Sales teams on RFQs, customer visits, technical presentations, and opportunity development.
Identify and promote internal and external market opportunities available throughout the K&S/Customer engagement process.
Capture and clearly communicate Voice of Customer (VOC), application requirements, and market insights to global Product Management and Engineering teams.
Collaborate cross-functionally with Sales, Applications, Service, and Factory teams to resolve issues and manage customer escalations.
Ensure adherence to company processes while maintaining strong, positive relationships with customers and internal stakeholders.
Job Requirements
Bachelor or Master in Mechanical / Electrical Engineering or related field.
At least 5 to 10 years of experience in semiconductor backend equipment, applications, process engineering, or technical sales.
Solid working knowledge of ball bonding and/or wedge bonding processes and production environments.
Experience supporting OSAT or IDM customers in Malaysia or Southeast Asia is preferred.
Strong technical problem-solving and analytical abilities.
Clear, effective communication skills with both customers and cross-functional teams.
Ability to work independently within a customer-facing, matrix organization.
Willingness to travel up to 40% within Malaysia, and occasionally within Southeast Asia and India.