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NPI MANAGER [WK1214-14]

Job title: NPI MANAGER [WK1214-14]
Location: Muar
Specialisation:
Salary: RM8,000 - RM12,000
Reference: PR/146372
Contact details: Wai Kin Lee
Contact email: WaiKin.Lee@jac-recruitment.com
Job published: November 19, 2021 05:57
JOB RESPONSIBILITIES
  • Manage NPI projects, perform design, process, and material optimizations to ensure robust NPI introduction.
  • Schedule 1st Si, engineering samples and qualification build. Plan resources to ensure smooth execution.
  • Liaise with Assembly Package Technology Development (APTD), Package design, PE, Test, Process, QRA team on NPI project schedule for Die Bond and Wire Bond Operation.
  • Understand technical risk and able to push technical envelope whenever possible to design packaging solution that is processable, optimizing quality vs cost and cycle time.
  • Perform Technical Risk Assessment on NPI projects. Plan materials, process, and equipment selection to mitigate risk. Plan Checkout and FUT to validate process are good to support qualification build.
  • Resolve technical challenges and perform root cause analysis on any quality and reliability issues encountered during the various builds.
  • Maintain the product realization workflow and documents checkout, FUT, qualification reports to meet TS certification.
  • Work with Technology Development team to understand new technology challenges and adapt technology to support new product NPI.
  • Collaborate with Technology Development team to adapt new technologies to support NPI.
  • Define NPI POR, TOR and BOM and oversee transition to High Volume Manufacturing (HVM).
  • Lead and develop NPI Team as well as monitor team members’ skills and performance.
  • Drive and enhance technical development of team members.
JOB REQUIREMENTS
  • Possess Diploma / Bachelor’s Degree in Engineering or equivalent.
  • Proven managerial experience in Manufacturing industry and experience in leading NPI projects.
  • Exposure to backend Semiconductor industry would be added advantage.
  • Equipped with advance package methodologies (process engineering or material engineering).
  • Knowledgeable in IC Packaging Assembly Process Flow.
  • Good knowledge in process characterization and data analysis.
  • Excellent management and problem-solving skills.
  • Strong communication and coordination skills.
 
Interested candidates are welcomed to apply online or send your latest resume to waikin.lee@jac-recruitment.com
 
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