Provide process support for Electroplating processes.
Responsible for trial run of new products, new machines, new materials and etc.
To implement actions to improve yield, quality, productivity and process stability.
To manage plating line including tank chemistry, plating processing, chemical analysis, and process control
Manage plating chemical and material consumption effectively with respective counterparts based on production forecast and engineering projects.
Able to train plating employees on new and existing processes.
To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application.
Job Requirement:
- Candidate must possess at least Bachelor’s or Associates Degree in Chemistry/Metallurgy/Plating Technology. Bachelor's Degree in Engineering (Material Science), Engineering (Chemical), Engineering (Mechanical), Engineering (Electrical / Electronic), Physics, Chemistry or equivalent.
More than 3 years working experience.
Preferably Engineer specialized in Electroplating / Production Operations or equivalent.
Possess high Semiconductors Process Development Engineering skills on Wafer Level Packaging and Back End Operations.
Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is
Candidate must be comfortable to work in a chemical environment.