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Senior Failure Analysis Engineer

Job title: Senior Failure Analysis Engineer
Location: Penang
Specialisation: Engineering & Manufacturing
Salary: MYR 72,000 - 110,000 (Annual)
Reference: PR/156990
Contact details: Hasmidar Hasan
Contact email: hasmidar.hasan@jac-recruitment.com
Job published: March 18, 2024 16:31
A fast-growing multinational company specializes in the development of cutting-edge analog and mixed-signal integrated circuits (ICs) tailored for the power supply market is expanding their engineering team. You will be a key part of helping the business to identify challenges to growth as it expands market share in Malaysia and Southeast Asia.
 
Job Descriptions:
  • The Senior Failure Analysis Engineer will perform IC level failure analysis to support RMA and internal/external customer issues.
  • Performing fault isolation and defect analysis/characterization on power IC’s to identify root causes of product failures in power supply applications and/or in production test.
  • Provide comprehensive technical reports to customers on findings from product failure investigations.
  •  Provide corrective actions to internal and external customers based on the results of the analysis.
  • Visit customers as necessary to resolve customer satisfaction issues arising from any quality problems 
  • Provide support to customers in Asia on quality problem resolution to ensure customer satisfaction. 
  • Responsibility will also include effective verbal and written communication of results, which will be used to drive improvements in product design, process technology, and applications. Such communication will require, but not limited to, writing cogent and convincing technical reports suitable for external customers.
 
Job Requirements:
  • Candidates with background and experience in automotive failure analysis/customer communication will be given preference.
  • Good verbal and technical writing skill in English is required.
  •  Minimum of 5 years of experience in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  •  Hands-on experience in failure analysis, and electrical fault isolation and defect characterization tools and techniques such as the following: ATE, curve trace, nano/micro-probing, OBIRCH/EMMI microscopy, liquid crystal, CSAM, XRAY, FIB, SEM/EDX and manual cross-sectioning and deprocessing techniques using both parallel-polishing and wet chemical etch techniques.
  • In-depth understanding of both digital and analog circuits, device physics and IC fabrication processes.
  •  Ability to interpret IC ATE test data log is required. Ability to interpret system level schematics, the IC level schematics, and IC layout of CMOS and bipolar devices is required.
Interested candidate please send your resume to the quick apply button at the bottom of this page.