An established MNC in wafer packaging industry, seeking talented individuals with an innovative mindset to join their Engineering team. You will be a key part of revolutionary in the advanced packaging equipment for automated and high precision manufacturing industries.
Job Descriptions
Developing, configuring and optimizing SMT processes from inception through to start up and certification.
Assessing processes, taking measurements, interpreting data and create engineering report.
Design, run, test and upgrade SMT systems and processes.
Provide training and leadership for a team of technicians and operators.
Define and generate relevant design rules, defect catalog and process documentation.
Develop best practices, routines and innovative solutions to improve production rates and quality of output.
Perform process simulations and risk assessments.
Manage cost and time constraints.
Provide process documentation and operating instructions.
Job Requirements
At least a Bachelor's Degree in Engineering (Electrical/Electronic), Physics, Chemistry or equivalent.
Min 1-2 years of experience in the field of semiconductor and/ or electrical component.
Min 1-2 years of experience in SMT equipment development and/or SMT process development.
Stencil design experience is advantageous.
Knowledgeable in DOE, SPC, GR&R, FMEA and 8D methodologies.
Able to communicate with customer.
Analytical with interpersonal skills and the ability to work independently.