An established MNC in wafer packaging industry, seeking talented individuals with an innovative mindset to join their Engineering team. You will be a key part of revolutionary in the advanced packaging equipment for automated and high precision manufacturing industries.
Job Descriptions
- Developing, configuring and optimizing SMT processes from inception through to start up and certification.
- Assessing processes, taking measurements, interpreting data and create engineering report.
- Design, run, test and upgrade SMT systems and processes.
- Provide training and leadership for a team of technicians and operators.
- Define and generate relevant design rules, defect catalog and process documentation.
- Develop best practices, routines and innovative solutions to improve production rates and quality of output.
- Perform process simulations and risk assessments.
- Manage cost and time constraints.
- Provide process documentation and operating instructions.
Job Requirements
- At least a Bachelor's Degree in Engineering (Electrical/Electronic), Physics, Chemistry or equivalent.
- Min 1-2 years of experience in the field of semiconductor and/ or electrical component.
- Min 1-2 years of experience in SMT equipment development and/or SMT process development.
- Stencil design experience is advantageous.
- Knowledgeable in DOE, SPC, GR&R, FMEA and 8D methodologies.
- Able to communicate with customer.
Analytical with interpersonal skills and the ability to work independently.