Job Descriptions:
- To drive improvement on assembly yield, quality, delivery and cost on mass production products.
- To manage new product introduction at subcontractor factory.
- To support new products, process and package development
- To drive investigation and solution on customer complaint case
- To perform regular process and quality audit at subcontractor site.
- Strong interaction with cross functional team on assembly engineering project.
Job Requirements
- Bachelor’s degree or above in engineering.
- Min 7 years of experience in semiconductor assembly process / NPI engineering or
- assembly subcon management.
- Hand-on experience in wire bonding and/or molding process is very desirable.
- Possess a good understanding on assembly process control and requirement.
- Strong project management and problem-solving skills.
- Fluent in English
- Technically competent, self-motivated, strong commitment and assertive